Hoki Universal BGA Reballing Stencils for Rework Station

These stencils are composed of high-quality stainless steel mesh with a precise thickness. There are 27 PCS in each set, which is more than enough to fulfil your various needs. They can be heated with a hot air machine, although they are difficult to deform when heated. It is intended specifically for BGA chips in laptops, desktops, communication mainboards, north-south bridges, graphics cards, and other BGA chips.

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