HiTech Heat sink compound is used to fill in spaces between the mechanical heat sink and the central processor unit (CPU) or other heat-generating components. Over the CPU is the mechanical heat sink, a passive part constructed of conductive metal. It Is best for voltage regulators, MOSFETs, motor drivers, audio amplifiers, etc.

Features:

• It has high thermal conductivity
• It Is more stable at high temperature
• It Is used in electrical and electronics devices

Specification