Description
HiTech Heat sink compound is used to fill in spaces between the mechanical heat sink and the central processor unit (CPU) or other heat-generating components. Over the CPU is the mechanical heat sink, a passive part constructed of conductive metal. It Is best for voltage regulators, MOSFETs, motor drivers, audio amplifiers, etc.
Features:
- It has high thermal conductivity
- It Is more stable at high temperature
- It Is used in electrical and electronics devices
Specification
| Brand | HiTech |
| Type | Heat Sink Compound |
| Box Weight | 15g |
| Quantity | 10 |
| Country of Origin | China |